KPTronix  leverages globally proven technology & tools to develop mission  critical systems.
Schematic Design Schematic Design
PCB Design Orcad, Mentor Graphics
Gerber CAM360
Signal Integrity Mentor Graphics, Hyperlynx
Thermal Analysis Mentor Graphics, Hyperlynx
Power Interity Analysis Mentor Graphics, Hyperlynx
Platform Architectures DSP, Microcontrollers, ARM ,

State of the art board-level design utilizing the latest technologies ensures creation of cost optimized designs. The level of signal integrity, power consumption, EMI/EMC, manufacturability and testability is controlled to optimally suite the requirement of the project. KPTronix's hardware design team is capable of developing Board Solutions from a simple conceptual block diagram to a future proof board to suit customer's long time requirements. KPTronix's approach to board design is result of its experience in serving wide spectrum of global clients with highly varied requirements. We have expertise in following system designs:

• ARM & DSP , 32/64bit Micro-Controller/ Micro-Processor based systems

• FPGA/CPLD plus embedded controller based boards

• Ruggedized and Conduction cooled boards.

• Mixed Signal, High speed system design

• Component Selection & BOM Optimisation

• Power Management (Low, medium and high voltage applications)

• Reliability MTBF Analysis

• Interfaces System design for

a.Communication(USB, Ethernet, CAN, Bluetooth, WiFi, PCIe),

b.Multimedia, (Audio, Video, Camera)

c. Serial, (UART, SPI, I2C,RS485,RS422)


e. GPIO, A/D, D/A, and analog

f.Storage: SSD, SATA, Flash, SDRAM, SD/MMC

KPTronix's hardware design team is capable of designing systems for requirements like:
• Design for high volume
• Low cost design
• Production Test: electrical, functional, boundary scan
• Bed of nails design

KPTronix has the tools and knowledge to design your PCB no matter how large or small. With handson experience of 100+ hardware designs of leading processors & platform, we have gained expertise in complex, high speed and high density boards.

We use the industries top tier design tools and are driven to be the best. kptronics

HDI Designs with micro vias and advanced materials - Via-in-Pad, burried via, blind via, laser micro vias. High speed, multi layer digital PCB designs - Bus routing, differential pairs, matched lengths. More than 25% of design with 10-16 layer pcbs. PCB Designs for space, military, medical and commercial applications Extensive RF and analog design experience (printed antennas, guard rings , RF shields...) Signal integrity issues to meet your digital design needs (tuned traces, diff pairs...) PCB Layer management for signal integrity and impedance control DDR, DDR2, DDR3, SAS and differential pair routing expertise High density SMT designs (BGA, uBGA, PCI, PCIE, CPCI...) Flex PCB designs of all types Low level analog PCB designs for metering Ultra low EMI designs for MRI applications Complete assembly drawings In-Circuit Test data generation (ICT) Drill, panel and cutout drawings designed Professional fabrication documents created


Signal integrity or SI is a set of measures of the quality of an electrical signal. In digital electronics, a stream of binary values is represented by a voltage (or current) waveform. However, digital signals are fundamentally analog in nature, and all signals are subject to effects such as noise, distortion, and loss. Over short distances and at low bit rates, a simple conductor can transmit this with sufficient fidelity. At high bit rates and over longer distances or through various mediums, various effects can degrade the electrical signal to the point where errors occur and the system or device fails.


Signal integrity engineering is the task of analyzing and mitigating these effects. Signal integrity engineering is an important activity at all levels of electronics packaging and assembly, from internal connections of an integrated circuit (IC), through the package, the printed circuit board (PCB), the backplane, and inter-system connections. While there are some common themes at these various levels, there are also practical considerations, in particular the interconnect time versus the bit period, that cause substantial differences in the approach to signal integrity for on-chip connections versus chip-to-chip connections.

KPTronix hardware design team is capable of:
• High Speed Signals/Circuit Simulations
• Simulation using Spice and IBIS Models
• Transmission Models with Electrical Characteristics
• Serpentine Track for Length Matching
• Impedance Matching for maximum power transmission
• Delay Matching for Timing especially for DDR Memories
• Layout & Routing with pre and post SI analysis
• Signal Routing
• Design Rule Checking
• Layout Verses Schematic Checking

Our design activities include decoupling design involving capacitor placement and selection (dielectric types, body sizes and values), via placement, capacitor landing pad design, ferrite bead selection, design of Pi filters to create quiet power for PLL/DLL/Clock oscillator circuits, and the design and analysis of power islands/power splits.


A shortened time to market, often limits the amount of product testing that can be performed. Microprocessor-based products released with unstable memory may experience only intermittent failures, but even those can lead to a costly recall. To minimize that risk, comprehensive memory timing analysis need to be performed during the design phase of the product.


Net topologies, trace impedances and terminations play an important role in waveform integrity. Trace length, vias and cross talk play an important role in timing.. A combined signal integrity analysis and timing analysis environment is needed to guarantee proper function of the DDR interface.

JEDEC timing requirements

In the JESD79 and JESD208 documents, more information can be found about the different DDRx specification. Thorough knowledge of the different timing parameters within a DDRx device is mandatory for performing detailed accurate timing analysis. By using high-speed design, analysis and verification techniques early in the design cycle, designers can eliminate layout iterations and ensure that products are marketed on time.


Designers are creating Printed Circuit Boards (PCBs) with higher density, higher power and smaller than ever before. Thermal analysis is necessary to keep up with these advances. To realize and solve potential problems in the design phase and avoid costly overdesign or failure due to thermal issues, thermal analyses must be performed. At KPTronix we offer thermal analysis :
*. Based on power, environment and materials
*. Based on detailed Gerber layout, drills and placement
*. Heat from components and DC currents
*. Standard FR4-based PCBs, IMS, DCB
*. Still air, forced air, heat sinks and cold plates
*. Heat Sink Design
*. Hot Spot Analysis


In Collaboration with our EMS partners, KPTronix's is capable of:
*. PCB Manufacturing
*. SMT (Surface Mount Technology) & Through-Hole
*. Consigned or Turnkey with quick turnaround time
*. Complex PCB's,
*. Ball Grid Array (BGA), X-ray Inspection & Optical
*. Inspections
*. ROHS Compliant
*. End of Life upgrade with new components


KPTronix's is capable of conducting Testing & Cerification through renowned labs as per Automotive, CE or Industrial Standards for
*. Radiated Emission Test
*. Conducted Emission (CE) Test
*. Radiated Immunity (RI) Test
*. Electrostatic Discharge (ESD) Test
*. EMI/EMC Tests
*. Cyclic Temperature & Humidity Test
*. Combined Temperature & Vibration Test
*. Altitude Test
*. Thermal shock test
*. Highly Accelerated Life Testing (HALT)

KPTronix internal quality control program encompasses all product design life cycles. We have expertise in designingHardware which meets qualifications and standards: Designs exceeding highest level of EMI / EMC requirements (IEC / ANSI) Designs meeting high Surges, radiated & conducted noise Designs meet Directive for CE marking Designs exceeding highest level of SAFETY requirements (TUV/ UL / CSA) Expertise in DFM & DFT Design for reliability - MTBF prediction System design as per Industrial & Automative grade requirements.